30MM 45KHZ Round Piezoelectric Ceramic Discs Positive and Negative in the Opposit Side.
Diameter (mm) | Thickness (mm) | Frequency (kHz) | Resistor (Ω) | Capacity (pF) | Dielectric loss-tg | Coupling factor-kp |
30 | 3 | 45 | 3 | 5500 | 0.3 | 0.58 |
30 | 4 | 46 | 3 | 3900 | 0.3 | 0.58 |
Customized round piezoelectric ceramic discs
Type: piezoelectric ceramic
Use: for ultrasonic equipment
Clear sound/high sound pressure
MOQ: 100 pieces
Main feature:
Extremely thin and light
Low power consumption
No EMI/RFI
Applications: (piezo ceramics element, piezo diaphragm, piezo plate)
For sound making: clocks, calculators, telephones, washing machines, various (burglar alarms and more)
For transduction: embryo monitor, heart reflectoscope reflector, pedometer, car alarm sensor
Brief description of piezo ceramic element and attributive characteristics
Electrode form/modulating: external drive (diode); self drive (transistor)
Thickness: thick (T>0.5mm); standard (0.5mm>T>0.2mm); thin (T<0.2mm); thinnest (0.03-0.05um)
Dimensions: smallest diameter is 8mm, biggest is 65mm
Metal plate types: brass, nickel, stainless steel
Connection terminal: solder wire or not
There are the high power piezoelectric ceramics in disc shape above; the standard material is P-81
High-power material P-86, P-85; medium-power material P-41, P-43, P-45 and more other materials are optional
It is piezoelectric ceramics for transmitting; the piezoelectric ceramics for receiving can be same dimension as above
Closed form solutions for all three modes of fracture for an infinite piezoelectric medium containing a center crack subjected to a combined mechanical and electrical loading were obtained. The explicit mechanical and electrical fields near the crack tip were derived, from which the strain energy release rate and the total potential energy release rate were obtained by using the crack closure integral. The suitability in using the stress intensity factor, the total energy release rate, or the mechanical strain energy release rate as the fracture criterion was discussed.